<bvernoux>
I can say I have validated their 4 layers Impedance Control which is not bad validated with USB3 SS at maximum speed (5Gbit/s) without any error
<bvernoux>
The only issue for RF stuff it their material which is in best case Prepreg 3313 with Dielectic constant 4.05
<bvernoux>
So OSHPark is clearly better for that
<bvernoux>
They have
<bvernoux>
PrepReg 1080 but no spec about Dielectric constant so far
<bvernoux>
The most amazing with actual promotion is to test their 8 layers for 2usd for 5 PCB (5cmx5cm max)
<bvernoux>
with ENIG and FR-4 TG155 by default for 8 layers
<bvernoux>
Something interesting they have option like Copper paste Filled & Capped for the Via (which cost extra) which could be very nice to use via as heatsink with very good properties for RF
<bvernoux>
They write in specs: The filling has an excellent heat conductivity of 8 W/m·K ideal for via-in-pad and heatsink pads
<bvernoux>
I have never see any feature like that with other PCB fab as standard
<d1b2>
<Tobi de Boumaa ⛟> any clues whats going wrong here? its the package from the msys2 package manager, I also tried building it from source, but I got No Vulkan glslc found when building despite a successful glslang build
<miek>
azonenberg: i just realised, i think the 2x thru is wrong for that board. it shouldn't de-embed all the way to the wider part of the trace, the measurement should include some of the 50ohm trace extending either side